For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. To learn more about Ansys and Samsung Foundry, visit Samsung SAFE Forum 2023 on Jwhere Ansys CEO Ajei Gopal will deliver a keynote address. 'This collaboration with Samsung Foundry makes the signoff fidelity of our Ansys multiphysics platform possible, and Ansys remains committed to powering the best user experience for our joint customers.' 'Ansys and Samsung are focused on delivering technology enablement solutions that meet our customers' needs on the leading edge of silicon technology,' said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. 'We continue to expand the areas of collaboration with Ansys to address new customer challenges in leading digital, full-custom, mixed-signal, and 3D-IC designs.'

'Samsung Foundry has traditionally worked very closely with Ansys to ensure that our mutual customers have timely access to the design tools they need to make the best possible use of Samsung's technology potential,' said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. These products are part of the broad array of multiphysics analysis and simulation products offered by Ansys to support the growing scale and complexity of modern chip, 3D-IC, and electronic system designs.

The predictive accuracy of Redhawk-SC and Totem has been verified through extensive testing as part of Samsung Foundry's certification process. Totem provides similar checking for custom analog and mixed-signal designs. RedHawk-SC provides industry-recognized signoff verification for electromigration (EM) and voltage drop (IR drop) on power distribution networks for digital designs. Samsung's 2nm process is its third generation of gate-all-around (GAA) process technologies and continues the rapid progression of Moore's Law using novel transistor devices for higher integration density, faster performance, and lower power.

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